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www..com GANGES TECHNOLOGY Ferrite Chip Bead For High Current Applications HCB Series P1. www..com High Current Chip Bead 1. Features HCB/HPB-series for Large Current Application HCB/HPB Series The HCB/HPB series can be used in high current circuits due to its low DC resistance. It can match power lines to maximum of 6A DC. 2. Dimension D Chip size Size 1608 A(mm) 1.60.15 2.00.20 3.20.20 3.20.20 4.50.20 4.50.20 5.70.2 B(mm) 0.800.15 1.250.20 1.600.20 2.500.20 1.600.20 3.200.20 5.00.3 C(mm) 0.800.15 0.850.20 1.100.20 1.300.20 1.600.20 1.500.20 1.80.2 D(mm) 0.300.2 0.500.3 0.500.3 0.500.3 0.500.3 0.500.3 0.50.3 A 2012 3216 3225 C 4516 B 4532 5750 3. Part Numbering HCB A A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current 301=300 , 300=30 T=Taping and Reel , B=Bulk(Bags) 10=1000mA=1A LxW 3216 B K C - 301 D T E 10 F 4.Specification Customer Part Number YOSONIC Part Number HCB1608K-300T30 HCB1608K-800T30 HCB1608K-121T20 HCB1608K-151T20 HCB1608K-221T20 HCB1608K-301T10 HCB1608K-471T10 HCB1608K-601T10 HCB2012K-300T30 HCB2012K-800T30 HCB2012K-121T20 HCB2012K-151T20 Impedance Test Frequency Rated Current DCR (Ohm) (MHz) (mA) max. (Ohm) max. 3025% 8025% 12025% 15025% 22025% 30025% 47025% 60025% 3025% 8025% 12025% 15025% 100 100 100 100 100 100 100 100 100 100 100 100 3000 3000 2000 2000 2000 1000 1000 1000 3000 3000 2000 2000 0.04 0.04 0.10 0.10 0.10 0.20 Reference For Large Current 0.20 0.20 0.04 0.04 0.10 0.10 P2. www..com Customer Part Number YOSONIC Part Number HCB2012K-221T20 HCB2012K-301T10 HCB2012K-471T10 HCB2012K-601T10 HPB2012Z-300T50 HPB2012Z-101T40 HPB2012Z-221T30 HPB2012Z-331T25 HPB2012Z-471T20 HPB2012Z-601T15 HCB3216K-300T30 HCB3216K-500T30 HCB3216K-800T30 HCB3216K-121T20 HCB3216K-151T20 HCB3216K-301T10 HCB3216K-471T10 HCB3216K-501T30 HCB3216K-601T20 HCB3225K-600T40 HCB3225K-900T20 HCB3225K-151T50 HCB3225K-201T40 HCB4516K-600T60 HCB4516K-800T30 HCB4516C-102T15 HCB4532K-800T60 HCB4532K-131T30 HCB4532K-151T50 HCB4532H-681T40 HCB4532H-132T30 HCB4532M-132T30 HCB5750V-101T60 HCB5750V-151T30 HCB5750V-181T30 HCB5750H-601T30 Impedance Test Frequency Rated Current DCR (Ohm) (MHz) (mA) max. (Ohm) max. 22025% 30025% 47025% 60025% 3025% 10025% 22025% 33025% 47025% 60025% 30 25% 50 25% 80 25% 120 25% 150 25% 300 25% 470 25% 500 25% 600 25% 60 25% 90 25% 150 25% 200 25% 60 25% 80 25% 1000 25% 80 25% 130 25% 150 25% 68025% 1300 25% 1300 25% 100 25% 150 25% 180 25% 600 25% 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 60 100 100 100 100 100 2000 1000 1000 1000 5000 4000 3000 2500 2000 1500 3000 3000 3000 2000 2000 1000 1000 3000 2000 4000 2000 5000 4000 6000 3000 1500 6000 3000 5000 4000 3000 3000 6000 3000 3000 3000 0.10 0.20 0.20 0.20 0.01 0.02 0.04 0.05 0.08 0.10 0.04 0.04 0.04 0.10 0.10 0.20 0.20 0.04 Reference For Large Current 0.10 0.03 0.10 0.02 0.03 0.01 0.04 0.15 0.01 0.04 0.02 0.03 0.06 0.06 0.01 0.04 0.04 0.04 5. Reliability and Test Condition Item Operating Temperature Storage temperature and humidity range Impedance Performance -55~+125 -55~+125 70%RH (max) Test Condition HP4291A, HP4287A+16092A Refer to standard electrical characteristics list DC Resistance Rated Current HP4338B 1000~6000mA (HCB), 1500~5000mA (HPB) P3. Test Condition Item Performance www..com Temperature Rise Test 30 max. (t) 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheating Dipping Natural cooling Preheat:150,60sec. 260C Solder : H63A Solder tamperature:2605 Flux: rosin second second Solder heat Resistance Appearance: No significant abnormality. Impedance change: Within 30%. 150C Dip time:100.5sec. Preheating Dipping Natural cooling Preheat:150,60sec. Solder : H63A Solder tamperature:2305 Flux: rosin More than 90% of the terminal Solderability 230C electrode should be covered with solder. 150C second second Dip time:41sec. For HCB HPB: Size 1608 2012 3216 3225 4516 4532 5750 Force (Kfg) 0.5 0.6 1.0 1.0 1.0 1.5 2.0 >25 Time(sec) The terminal electrode and the dielectric must Terminal strength W not be damaged by the forces applied on the right conditions. 20(.787) The terminal electrode and the dielectric must Flexture strength Bending 45(1.772) 45(1.772) not be damaged by the forces applied on the right conditions. Solder a chip on a test substrate, bend the substrate by 2mm (0.079in)and return. 40(1.575) 100(3.937) Series name mm(inches) 1608 2012 3216 3225 0.80(0.033) 0.14(0.055) 2.00(0.079) 2.70(0.106) P-Kgf 0.3 1.0 2.5 2.5 The ferrite should not be damaged by Bending Strength R 0.5(0.02) Forces applied on the right condition. A 4516 4532 Temperature:1255. Loading at High Temperature Appearance: no damage. Impedance: within30%of initial value. Applied current:rated current. Duration:50012hrs. Measured at room temperature after placing for 2 to 3hrs. Humidity:90~95%RH. Temperature:402. Loading under Damp Heat Appearance: no damage. Impedance: within30%of initial value. Applied current: rated current. Duration:50012hrs. Measured at room temperature after placing for 2 to 3hrs. Item Performance Test Condition P4. www..com Phase 1 Temperature() Time(min) -552 Room Temp. +1255 Room Temp. 303 10~15 303 10~15 Measured at room temperature after placing Measured:5 times for 2 to 3 hrs. Temperature:-552. Low temperature storage test For HCB HPB Condition for 1 cycle Step1:-552 Step3:+1255 Number of cycles:5 4 303 min. 303 min. Appearance: no damage. Thermal shock Step2:Room temperature 10 to15 min. 2 3 Step4: Room temperature 10 to15 min. Impedance: within30%of initial value. Appearance: no damage. Impedance: within30%of initial value. Applied current:rated current. Duration:50012hrs. Measured at room temperature after placing for 2 to 3hrs. Frequency: 10-55-10Hz for 1 min. Random Vibration Test Appearance: Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Impedance: Within30% of initial value. Amplitude: 1.52mm Directions and times: X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). Drop Drop 10 times on a concrete floor from a height of 75cm a: No mechanical damage b: Impedance change: 30% 6. Soldering and Mounting 6-1. Recommended PC Board Pattern L Chip size Series Type 1608 2012 3216 HCB/HPB 3225 4516 4532 Land Patterns For Reflow Soldering A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) G 1.60.15 2.00.20 3.20.20 3.20.20 4.50.20 4.50.20 0.800.15 0.800.15 0.300.2 1.250.20 0.850.20 0.500.3 1.600.20 1.100.20 0.500.3 2.500.20 1.300.20 0.500.3 1.600.20 1.600.20 0.500.3 3.200.20 1.500.20 0.500.3 2.60 3.00 4.40 4.40 5.70 5.90 0.60 1.00 2.20 2.20 2.70 2.57 0.80 1.00 1.40 3.40 1.40 4.22 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 6-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. YOSONIC terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 6-2.1 Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 6-2.2 Solder Wave: Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave , typical at 240. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure 2. 6-2.3 Soldering Iron(Figure 3): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Preheat circuit and products to 150 280 tip temperature (max) Never contact the ceramic with the iron tip 1.0mm tip diameter (max) Use a 20 watt soldering iron with tip diameter of 1.0mm Limit soldering time to 3 sec. H P6. www..com PRE-HEATING SOLDERING NATURAL COOLING P5. PRE-HEATING SOLDERING NATURAL COOLING PRE-HEATING SOLDERING NATURAL COOLING TEMPERATURE C TEMPERATURE C 0 0 Top cover tape 150 (302) 165 to180 150 0 230 TEMPERATURE C 230 (446) 250 F The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 280 230 150 Room Temp. () Room Humidity (%) Room atm (hPa) 860~1060 Over 1 min. Tearing Speed mm/min 300 Gradual Cooling Within 3 sec. Base tape Over 1 min. Over 1 min. Within 10 sec. Gradual Cooling 5~35 Gradual Cooling Within 3 sec. 45~85 Over 2 min. Figure 1. Re-flow Soldering Figure 2. Wave Soldering Figure 3. Hand Soldering 6-2.4 Solder Volume: Accordingly Increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: 7. Packaging Information 7-1. Reel Dimension A 13 .5 0 .5 20.5 Type 0.5 A(mm) 9.00.5 13.50.5 B(mm) 602 602 C(mm) 13.50.5 13.50.5 D(mm) 1782 1782 D B R1 C R1 .9 R0.5 7"x8mm 7"x12mm 120 7"x8mm 7"x12mm 7-2.1 Tape Dimension / 8mm P2:20.05 E:1.750.1 Po:40.1 1 D: .5 . +0 1 A t Series HCB size 160808 201209 321611 322513 Bo(mm) 1.800.10 2.250.10 3.500.10 3.420.10 Ao(mm) Ko(mm) P(mm) 1.010.10 1.020.10 1.420.10 1.040.10 1.880.10 1.270.10 2.770.10 1.550.10 4.00.1 4.00.1 4.00.1 4.00.1 t(mm) 0.220.05 0.220.05 0.220.05 0.220.05 W:8.00.1 HCB,HPB Bo F:3.50.05 HCB HCB 1 0. :1 D1 P A Ao Ko SECTION A-A 7-2.2 Tape Dimension / 12mm 1.750.1 Po:40.1 P2:2.00.05 D:1.5+0.1 t Series 5.50.05 W:12.00.1 Bo Size 451616 453215 575018 Bo(mm) Ao(mm) Ko(mm) P(mm) 4.950.1 4.950.1 6.100.1 1.930.1 3.660.1 5.400.1 1.930.1 1.850.1 2.000.1 4.00.1 8.00.1 8.00.1 t(mm) 0.240.05 0.240.05 0.30 HCB HCB D1:1.50.1 P Ao Ko HCB 7-3. Packaging Quantity Chip size Chip / Reel Inner box Middle box Carton Bulk (Bags) 575018 453215 1000 4000 20000 40000 4000 1000 4000 20000 40000 12000 451616 322513 2000 8000 40000 80000 20000 2500 12500 62500 125000 30000 321611 3000 15000 75000 150000 50000 201209 160808 4000 20000 100000 200000 150000 4000 20000 100000 200000 200000 7-4. Tearing Off Force www..com Typical Impedance v.s. Frequency Curve HCB1608K-300T30 120 160 HCB1608K-800T30 300 250 HCB1608K-121T20 IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 90 120 Z 80 200 150 100 50 60 Z Z 30 40 X R 1 10 100 1000 0 1 10 R 100 X 0 1000 1 10 R 100 X 0 1000 FREQUENCY(MHz) HCB1608K-151T20 300 250 400 FREQUENCY(MHz) HCB1608K-221T20 400 FREQUENCY(MHz) HCB1608K-301T10 Z IMPEDANCE(Ohm) 200 150 100 50 0 1 10 Z 200 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 300 Z 300 200 X 100 X R 100 1000 100 X R R 0 100 1000 1 10 100 1000 0 1 10 FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz) HCB1608K-471T10 800 800 HCB1608K-601T10 Z Z HCB2012K-300T30 90 IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 600 600 60 400 400 Z 30 200 200 X X R 1 10 100 1000 X 0 1 10 R 100 1000 0 0 1 10 R 100 1000 FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz) HCB2012K-151T20 400 HCB2012K-800T30 200 HCB2012K-121T20 300 160 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 120 Z 200 Z IMPEDANCE(Ohm) 300 200 Z 80 100 40 X 100 X 0 1 10 R 100 1000 0 1 10 R 0 100 1000 1 10 R 100 X 1000 FREQUENCY(MHz) HCB2012K-221T20 600 600 FREQUENCY(MHz) HCB2012K-301T10 800 FREQUENCY(MHz) HCB2012K-471T10 IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 600 400 400 Z Z Z 200 400 200 X R 0 1 10 100 1000 200 X 0 1 10 R 0 100 1000 1 10 R 100 X 1000 FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz) HCB2012K-601T10 800 HPB2012Z-300T50 100 300 250 HPB2012Z-101T40 Z IMPEDANCE(Ohm) 80 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 600 200 150 100 50 0 60 400 Z 40 Z 200 20 X 0 1 10 X R 1 10 100 1000 10000 R X 0 100 1000 R 1 10 100 1000 10000 FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz) www..com Typical Impedance v.s. Frequency Curve HPB2012Z-221T30 500 600 HPB2012Z-331T25 800 HPB2012Z-471T20 400 IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 600 400 Z 300 Z Z 400 200 200 200 100 X 0 1 10 X R 0 0 1 10 100 1000 10000 1 10 X R 100 1000 10000 R 100 1000 10000 FREQUENCY(MHz) HPB2012Z-601T15 800 FREQUENCY(MHz) HCB3216K-300T30 120 150 FREQUENCY(MHz) HCB3216K-500T30 Z IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 600 90 100 400 60 Z 50 Z 30 200 X R X R 1 10 100 1000 X R 0 1 10 100 1000 0 1 10 100 1000 10000 0 FREQUENCY(MHz) HCB3216K-800T30 160 360 300 FREQUENCY(MHz) HCB3216K-121T20 300 FREQUENCY(MHz) HCB3216K-151T20 IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 120 Z 80 240 180 120 60 200 Z Z X 40 100 X X R 1 10 100 1000 R 0 1 10 100 1000 0 R 0 1 10 100 1000 FREQUENCY(MHz) HCB3216K-301T10 400 800 FREQUENCY(MHz) HCB3216K-471T10 800 FREQUENCY(MHz) HCB3216K-501T30 Z 300 600 600 IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) Z 400 Z 200 400 100 200 200 X R 0 1 10 100 1000 0 1 10 X R X 0 100 1000 1 10 100 1000 R FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz) HCB3216K-601T20 800 HCB3225K-600T40 200 160 HCB3225K-900T20 Z 160 IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 600 120 Z 80 120 400 80 Z X 40 200 40 X R 0 1 10 100 1000 X 0 1 10 R 0 100 1000 1 10 R 100 1000 FREQUENCY(MHz) FREQUENCY(MHz) HCB3225K-201T40 300 FREQUENCY(MHz) HCB4516K-600T60 200 HCB3225K-151T50 300 Z IMPEDANCE(Ohm) 200 160 IMPEDANCE(Ohm) 200 Z IMPEDANCE(Ohm) 120 80 Z 100 100 X R 0 1 10 100 1000 0 1 10 100 X R 40 X R 1 10 100 1000 0 1000 FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz) www..com Typical Impedance v.s. Frequency Curve HCB4516K-800T30 200 3000 2500 HCB4516C-102T15 200 HCB4532K-800T60 160 Z IMPEDANCE(Ohm) 160 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 2000 1500 1000 500 120 120 Z 80 Z 80 40 X 40 0 1 10 R 100 1000 R 0 1 10 100 X 1000 0 1 10 R 100 X 1000 FREQUENCY(MHz) HCB4532K-131T30 250 250 FREQUENCY(MHz) HCB4532K-151T50 1500 FREQUENCY(MHz) HCB4532H-681T40 200 200 1200 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 150 Z 150 Z IMPEDANCE(Ohm) 900 Z 100 100 600 50 50 300 X 0 1 10 X 0 R 100 1000 R 1 10 100 1000 0 1 10 R 100 X 1000 FREQUENCY(MHz) HCB4532H-132T30 2000 2500 FREQUENCY(MHz) HCB4532M-132T30 250 FREQUENCY(MHz) HCB5750V-101T60 Z IMPEDANCE(Ohm) IMPEDANCE(Ohm) 1500 2000 200 Z 1500 IMPEDANCE(Ohm) 150 1000 Z 100 1000 500 500 50 X R 0 1 10 X 100 1000 0 1 10 R FREQUENCY(MHz) HCB5750V-181T30 X 0 100 1000 1 10 R 100 1000 FREQUENCY(MHz) HCB5750V-151T30 250 300 FREQUENCY(MHz) HCB5750H-601T30 600 Z 200 500 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 200 Z IMPEDANCE(Ohm) X Z 150 400 300 200 100 0 100 X 50 100 R 1 10 X 100 1000 R 0 1 10 100 1000 0 1 10 R 100 1000 FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz) |
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